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. 2023 Mar 10;23(6):3016. doi: 10.3390/s23063016

Figure 3.

Figure 3

(a) Digital image and (b) microscopy (20×) of c-Si cells of an AP50 module exhibiting early signs of delamination in the EVA/cell interface, (c) c-Si cell of an M55 module with extended delamination in the EVA/cell interface along the busbar, (d) microscopy (10×) of a c-Si cell in the same module showing similar delamination along the busbar, (e,f) digital images of M55 cells with severe corrosion on the busbar and interconnect ribbon due to high Tc developed there and EVA-molecule dissociation.