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. 2023 Apr 28;9:50. doi: 10.1038/s41378-023-00529-9

Fig. 1. Images of TSV-Cu and schematics of defect classification.

Fig. 1

a Atomic force microscopy image of 3-μm-diameter and 8-μm-deep TSV-Cu structure. b Optical simulation model of the TSV-Cu structure. c Cross-section of TSV-Cu and top-view image (insert) of Cu filling. d Schematic of defect division