Via direct mixing |
Disulfide bonds |
Polymerized alpha lipoic acid (ALA) |
NdFeB |
Magnetic Field |
Actuation |
Soft robotics |
[17] |
(Metal) ion bond |
Functionalized PEG hydrogel with pyrogallols |
Fe/Ca/Zn |
Autonomous/close distance |
Fast self-healing adhesive |
Biocompatible wound sealant |
[18] |
Intermolecular diffusion |
Ethylene glycol |
Fe3O4
|
Heat or magnetic field |
Phase transformation self-healing |
Cell engineering |
[19] |
Diels–Alder |
Polyethertriamine Jeffamine |
Fe3O4
|
Magnetic field and heat |
Closure of large gaps |
Soft robotics |
[21] |
Dipole-interaction |
Dowsil CY52-276 gel |
NdFeB and CIP |
Autonomous/residual magnetization |
Instantaneous self-healing regardless of cycles |
Bioengineering and soft robotics |
[20] |
Covalent bonds |
Chitosan |
Fe3O4
|
Magnetic field |
Actuation while shape shifting |
Biocompatible injectable |
[22] |
Schiff base |
Chitosan/alginate hydrogel and gelatin |
Fe3O4
|
Magnetic field |
Self-healing under physiological conditions |
Drug delivery |
[23] |
Metal ligand complex |
Dopamine-functionalized polyurethane |
Fe3O4 with MoS2
|
Heat and shape-memory |
EMI shielding |
Stretchable electronics |
[24] |
Ionic bond (disulfide, hydrogen, iron–carboxylate) |
Thioctic acid |
Fe3O4
|
Autonomous |
100% healing efficiency |
Shape construction |
[27] |
Hydrogen bond |
Carboxymethyl hydroxypropyl guar |
CoFe2O4
|
Magnetic field |
100% healing efficiency and actuation |
Soft robotics |
[25] |
Boric acid ester and hydrogen bonds |
Polypyrrole PPy |
ZnFe2O4 and MWCNT |
Autonomous |
Self-healing |
Electronic skins and drug delivery |
[26] |
Via surface engineering |
Hydrogen bonds |
NVP-DVB |
Fe3O4
|
Magnetic field |
Self-healing and weight bearing |
Soft robotics |
[28] |
Via additive manufacturing |
Schiff base |
Polysaccharides |
Fe3O4
|
Magnetic field |
Printed structure alteration |
3D tissue engineering |
[29] |
Via self-assembly |
Metal–ligand complex |
Polyurethane |
Fe3O4
|
Autonomous |
Fast and efficient self-healing during actuation |
Smart biomimetic devices |
[30] |