Figure 1.

Schematic overview of the scaffold fabrication. Step 1. Start with a silicon wafer with a 1–2 µm thick silicon dioxide layer. 2. Spin coat SC1813 on wafer surface and soft bake. 3. Expose the SC1813 through chrome mask with desired patterns. 4. Develop. 5. Etch the silicon dioxide with buffered hydrofluoric acid and strip the SC1813 from the wafer surface using acetone. 6. Spin coat PCL solution on the etched mold to create through holes and attach SU8 ring to edges of the PCL scaffold by dipping the ring in concentrated PCL for bonding with the scaffold. 7. Release the scaffold by etching overnight in buffered HF. The SU-8 ring keeps the scaffold from folding and allows for handling.