Material Compatibility |
Selection of compatible materials, optimization of printing parameters, post-processing techniques such as diffusion bonding or brazing |
Porosity |
High printing temperatures, lower printing speeds, lower layer height, use of support materials |
Cracks |
Optimization of printing parameters, use of support structures, post-processing techniques such as annealing and coating |
Loss of Alloying Elements |
Optimization of printing parameters, use of pre-alloyed powders or wires, post-processing techniques such as annealing or heat treatment |
Oxide Inclusions |
Use of inert or reducing atmospheres, post-processing techniques such as hot isostatic pressing (HIP) or hot forging |
Interfacial Phases and Unmelted Particles |
Use of interlayers or transition layers, using multiple lasers, post-processing techniques such as hot isostatic pressing (HIP) or hot forging |
Thermal and Mechanical Mismatch |
Laser shock peening, annealing, hot isostatic pressing |
Surface Finishing |
Electrochemical polishing, abrasive flow machining, laser-assisted polishing |
Residual Stresses |
Shot peening, thermal stress relief, vibratory stress relief |
Corrosion and Wear Resistance |
Chemical passivation, plasma nitriding, electroless plating |