Figure 2.

(a) Schematic of glass-embedded Ag meshes fabrication process: (i) transparent glass substrate, (ii) photoresist coating, (iii) photolithography, (iv) reactive-ion etching, (v) photoresist removal, (vi) Ag ink coating and curing, (vii) removal of Ag by a razor blade, and finally (viii) glass-embedded Ag mesh. The Ag meshes are hexagonal arrays embedded into a glass substrate, defined by width W, pitch P, and thickness t. (b) Scanning electron microscopy (SEM) images of (i) W1P25t0.5 and (ii) W1P25t0.8 samples taken at an 80° angle from directly overhead with actual widths of 1.3 and 1.6 μm, respectively.