Table 1.
MS Type | Target–Substrate Distance (cm) |
Time of Powering Break (s) | Sputtering Time (min) | Power (W) | Sputtering Pressure (mbar) | Oxygen Flow (sccm) |
---|---|---|---|---|---|---|
sequential | 8 | 1 | 180 | 450 | 1.2 × 10−2 | 18 |
12 | 360 | |||||
continuous | 8 | - | 90 | |||
12 | 180 |
MS Type | Target–Substrate Distance (cm) |
Time of Powering Break (s) | Sputtering Time (min) | Power (W) | Sputtering Pressure (mbar) | Oxygen Flow (sccm) |
---|---|---|---|---|---|---|
sequential | 8 | 1 | 180 | 450 | 1.2 × 10−2 | 18 |
12 | 360 | |||||
continuous | 8 | - | 90 | |||
12 | 180 |