Bottom-up |
chemical vapor deposition |
Si nanowire |
Si nanowire around 2–3 μm long, with an average diameter at the bottom of about 40–70 nm |
- |
[120,143] |
Fractal structured TiO2 network |
TiO2 nano fractal structured |
Form TiO2 for 20 min at 65 °C, and calcination process at 650 °C for 1 h in an air atmosphere. |
[129] |
chemical bath deposition |
MoO3
|
MoO3 sea urchin-like microstructures |
The reaction mixture was heated to 90 °C for 3 h. |
[144] |
3D printing |
photosensitive resin transfer to PDMS |
Micro needle: the height, bottom diameter, and top diameter of the needle are about 880, 470, and 25 μm, respectively |
- |
[124] |
3D arrays of pores of 2 μm in diameter and 1.4, 1.8 and 2.2 μm in depth |
- |
[145] |
Self-assembly particles |
PS beads |
1.5 μm-diameter monodisperse PS spheres |
24 h for PS beads Self-assembly |
[123] |
Chemical synthesis |
CuO nanorods |
CuO nanorods structure has a smooth surface with a diameter ranging from 50 to 100 nm, and the length of the rods is estimated to be 5 μm. |
heated at 500 °C for 120 min |
[126] |
AAO nanopores |
46–72 nm nanopores in 4 cm2
|
3 min anodization and 10 min etching |
[130] |
nanopores with 100 nm depth and a 80 nm diameter. |
7 h anodization and total 5 h etching |
[135] |
Top-down |
Chemical etching |
Si micropyramid |
8.4 µm Si micropyramid in 4 inches wafer |
85 °C for 90 min etching in KOH |
[119] |
Chemical etching |
Porous Au |
the width of the Au ligaments is in the range of 40 nm |
copper etching of the stacked multilayers at room temperature for 300 min to form the porous Au |
[149] |
Metal assisted chemical etching |
Si nanowires |
440–480 nm Si nanowires |
Etching in the solution containing AgNO3,hydrofluoric acid (HF), and DI water for 6 min. |
[121] |
SF6/O2 gas reactive ion etching |
Si nanopillar |
Si nanopillar with height of 639–2217 nm, apex thickness of 112–144 nm. |
SF6/O2 gas reactive ion etching for 18–30 min. |
[150] |
Laser processing |
ZnO |
Nanostrip, nanopillar array, nanogrooves, nanocavities. |
- |
[125] |