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. 2023 Aug 2;13:12515. doi: 10.1038/s41598-023-39476-w

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© The Author(s) 2023

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

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(a) RF measurement setup for microstrip line samples. (b) Cross-section schematic of inkjet printed ramp interconnects for MMIC die on a 3D printed Polypropylene substrate. (c) Cross-section view of the ramp interconnects structure for reliability tests. (d) Cyclic bending tests system. (e) Measurement results of monolithic bending tests for bending radii 1–4 inches. (f) Measurement results of cyclic bending tests up to 10,000 cycles.