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. 2023 Aug 25;16(17):5822. doi: 10.3390/ma16175822

Figure 4.

Figure 4

Microstructure analysis of the as-fabricated Cu joint. (a) Cross-section FIB ion image. The bonding interface is pointed out by the red arrow. (b) Corresponding cross-sectional EBSD image for the Cu joint in Figure 1a. Inverse pole figure is shown. (c) FIB electron image at the bonding interface of the Cu joint in Figure 1a. The bonding interface is indicated by the red dotted line.