Table 6.

Comparative analysis of plasma processes vs. wet chemical processes in surface treatments.

	Plasma Processes	Wet Chemical Processes
Uniformity and surface geometry compatibility	Can uniformly modify surfaces, including those with intricate geometry.	May encounter difficulties ensuring uniform treatment on surfaces with complex geometry due to limitations in chemical access and differential wetting behavior.
Environmental footprint	Tend to have a reduced environmental footprint as they usually do not require hazardous chemicals and generate minimal waste.	Typically involve solvents and reagents that require stringent disposal procedures to prevent environmental contamination.
Versatility of surface modifications	Both methods are adaptable, but plasma processes offer a wider range of possible surface activations, cleanings, etchings and graftings in a single step.
Precision in controlling surface properties	Allow for fine-tuned control over surface properties by manipulating parameters such as gas type, power, pressure and duration.	May offer less precision in determining final surface properties due to factors such as inconsistent reaction kinetics and diffusion limitations.
Process Speed	Tend to be relatively rapid, with many procedures only requiring minutes.	Some processes can be more time-consuming, particularly those involving multiple reaction steps or prolonged diffusion times.
Operation temperature	Can be executed at ambient temperature, making them suitable for heat-sensitive materials.	Some wet chemical treatments might require elevated temperatures.
Post-treatment cleaning requirements	Generally, do not necessitate post-treatment cleaning as the process leaves no chemical residues.	Often require thorough rinsing or other cleaning procedures to ensure removal of residual reagents and by-products.