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. Author manuscript; available in PMC: 2023 Sep 8.
Published in final edited form as: Methods Mol Biol. 2022;2403:201–213. doi: 10.1007/978-1-0716-1847-9_13

Figure 2:

Figure 2:

A) Schematic of bonding setup. B) Side view of bonding setup. Solvent (ACN) is added to bond the devices at 70˚C. Excess solvent must be quickly removed to avoid etching C) Bottom view of bonded device.