Extended Data Fig. 8. Interfacial analysis of the glueline region and thermal analysis of FPL.
a, FTIR microscopy image of the glueline region recorded at a wavenumber of 1597 cm−1. b, c, SEM image (b) and schematic illustration (c) of the glue line region. These images demonstrated that the vessels at the glueline region were filled with lignin adhesives after hot pressing. d, e, DSC (d) and TG results (e) of FPL. Due to the relatively low glass transition temperature of FPL (Tg = 100–144 °C), FPL adhesives could be softened at a low hot-pressing temperature as low as 100 °C. f, The characteristic linkages in biomass and their corresponding FTIR absorption wavenumbers.