Table 1.

Overview of D-band technology platforms.

TECHNOLOGY*	Cost	Feature size	Tol.	SR	Scalability	MMIC int.	IL (dB/mm)
CNC12–15	High	$<10\mathrm{\mu }$m	$2.5\mathrm{\mu }$m	Medium${}^{+}$	Low	Complex	0.00715
DMLS / SLM18–22	Medium	$<50\mathrm{\mu }$m	$<15\mathrm{\mu }$m	High${}^{+}$	Low	Complex	0.01918
SLA22, 23	High	$<10\mathrm{\mu }$m	$<10\mathrm{\mu }$m	High${}^{+}$	Low	Complex	0.02522
Injection molding27, 28	High	$<10\mathrm{\mu }$m	$25\mathrm{\mu }$m	High${}^{+}$	High	Complex	0.042$‡$27
SU-813, 14, 31	Medium	$<1\mathrm{\mu }$m	$10\mathrm{\mu }$m	Low	Medium	Medium	0.01131
SMW14, 33, 34	Medium	$<1\mathrm{\mu }$m	$<1\mathrm{\mu }$m	Low	High	Medium	0.0134
LTCC40, 41	Low	$25\mathrm{\mu }$m	$10\mathrm{\mu }$m	Medium	High	Easy	0.441
PCB (this work)	Low	$25\mathrm{\mu }$m	$10\mathrm{\mu }$m	Medium	High	Easy	0.08

*The minimal feature size and tolerances (Tol.) are highly dependent on the chosen materials, the selected fabrication process and the surface finish.

SR is the surface roughness, ${}^{+}$ SR can significantly be improved upon by employing (expensive) smoothing techniques, such as polishing.

IL is the lowest reported mean value of the insertion loss over the entire D-band, except for $‡$ evaluated at 110 GHz.