Fig. 1. Schematic diagram of the composition and fabrication of MEAP.

a Different constituents and their function in MEAP. b Schematic diagram of adhesion between TPP electrode and skin. c Photographs of the performance of TPP electrodes during stretching and on skin. d The fabrication process of MEAP. The liquid metal ink is prepared to make MPC circuits. TPP contact sites are cast on the substrate using moulds. The adhesive encapsulation layer, PPA, is fabricated to cover circuits and expose contact sites only. e Photographs of MEAP during stretching, bending and twisting. MEAP can be stored on a release film and uncovered simply to attach on skin for sEMG recording.