Figure 2.
Microfluidic structures processed in COC photographed after each step of the process. (A) Shaping the microchannels through embossing (160 °C, 10 min, 2.3 MPa); (B) sealing using thermal bonding (130 °C, 30 min, 2.3 MPa); and (C) connecting the microfluidic device to the outside world using PEEK connectors glued to the device.