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. 2023 Oct 12;29(5):574–588. doi: 10.1089/ten.teb.2023.0006

FIG. 5.

FIG. 5.

Diagram of the interaction between ligand density and stiffness of the culture substrate observed in the tecophilic/gelatin electrospun scaffolds. Reprinted (adapted) from Vatankhah et al.130 with permission from the American Chemical Society. Color images are available online.