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. 2023 Nov 6;14:7132. doi: 10.1038/s41467-023-42838-7

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© The Author(s) 2023

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

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Fig. 3 — a Viscosity curve of the VegPU/Ag ink. b Photo images of the printed VegPU/Ag electrode before and after sintering solution treatment, scale bar: 600 µm. c The resistance change of freshly printed VegPU/Ag electrode during sintering solution, DI water, and heat treatment. d Conductivity, surface profiles (e), thickness (f), SEM images (g), C-AFM (h) of sintering solution-, DI water-, and heat-treated VegPU/Ag electrode (n = 3). i The recycling of the VegPU/Ag conductor printed on VegPU substrate, including dissolving in DMF solvent, collecting of the VegPU and Ag flakes, and the degradation of VegPU at the end of life. Scale bar in (g): 2 µm.