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. 2023 Nov 13;23(22):9150. doi: 10.3390/s23229150

Table 1.

Chip characteristics of the 2.1 μm F-DTI pixel.

Characteristics Data
Process Pixel 65 nm/Logic 28 nm, stacked BSI
Power supply 2.8 V/1.8 V/1.05 V
Si thickness 3.0 μm
Pixel array (H × V) 3840 × 2160
Max frame rate 36 fps @ 12 bit
FWC (LPD, SPD, in-pixel capacitor) 10 ke-, 10 ke-, 210 ke-
Sensitivity 32,000 e-/lux.sec (RCCB)
Sensitivity ratio 10
Conversion gain (HCG, LOFIC) 185 μV/e-, 4.2 μV/e-
Read noise (HCG) 0.83 e-
Single-exposure DR @ Tj 85 °C 120 dB
Minimum SNR dip @ Tj 105 °C 25 dB
Color filter array RCCB (RGGB, RCCG, RYYCy support)