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. 2023 Dec 7;16:45. doi: 10.1007/s40820-023-01254-8

Table 2.

The summary of characteristics of PeLEDs with in-situ crystallization patterning

Fabrication method Materials Min pattern size (μm) Max printing area (mm2) Max EQE [%] Max luminance (cd m−2) References
Inkjet printing CsPbBr3 125  ~ 700 2.12 (G) 2,500 [44]
Inkjet printing CsPbBr3 30 1,288 9.0 (G) 3,640 (G) [40]
kjet printing CsPbX3 50 10

3.5 (R)

3.4 (G)

1.0 (B)

267 (R)

956 (G)

146 (B)

[22]
Inkjet printing MAPbBr3 250 0.8 (G) 10,227 (G) [23]
Inkjet printing CsPbBr3 50 10 10.1 (G) 12,882 (G) [42]
Inkjet printing FAPbBr3 45 400 4.5 (G) 12,738 (G) [45]
Laser lithography CsPbBr3 0.5

CE

 = 1.9 cd A−1 (G)

18,390 (G) [35]
Thermal evaporation

CsPbBr3/

Cs4PbBr6

100 4,020 8.0 (G)  ~ 20,000 (G) [33]
Thermal evaporation CsPbBr3-TPPO a) 20 7,994 16.4 (G)  ~ 10,000 (G) [43]

Photo

lithography

(PEABr)xCsPbBr3 20  ~ 1.1 1.2 (G) 13,043 (G) [20]
E-beam lithography

MAPbX3

(X = I, Br, Cl)

20  ~ 34  ~ 0.1 (G)  ~ 1800 (G) [36]

a) TPPO: triphenylphosphine oxide