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. 2023 Dec 15;13(24):3148. doi: 10.3390/nano13243148

Figure 5.

Figure 5

(a) Negative molds design; (b) 3D printed mold via SLA technology; (c) trenches and electrode patterns filled with PDMS conductive ink; (d) electrodes after Au sputtering; (e) electrodes after Au electroplating; (f) Au (left) and carbon (right) full chip [83]. Copyright 2015, Elsevier.