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. 2024 Jan 25;15:751. doi: 10.1038/s41467-024-44750-0

Fig. 3. Techniques to attach a laser to a silicon PIC.

Fig. 3

a Conventional laser-isolator (ISO)-fiber-PIC with free-space optics (FSO). b Hybrid 2.5D with FSO. c Hybrid 2.5D with photonic wire bonding (PWB). d Hybrid 3D (flip chip or transfer printing). e Heterogenous (Direct bonding or transfer printing). f Monolithic (Hetero-epitaxy).