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. 2024 Jan 21;14(2):233. doi: 10.3390/nano14020233

Figure 3.

Figure 3

Cu/Sn SLID sample: (a) scheme of the sample with top Cu/Sn and bottom Cu bump before bonding (not to scale); (b) scanning electron microscopy (SEM) image of the sample with a Cu/IMC/Cu stack after 1 min bonding at 240 °C (almost the whole interlayer (Sn) is transformed into Cu6Sn5 IMC).