Table 2.
Fillers and methods with the highest TPTC values.
| Matrix | Filler | Loading | Technique | Thermal Conductivity (Wm−1K−1) |
|---|---|---|---|---|
| Epoxy | Silicon Carbide | 3.71 vol% | Template-assisted chemical vapor deposition approach | 14.32 (k⊥) |
| Vinyl polydimethylsiloxane (PDMS) | CFs, Al2O3 |
24 vol%, 47 vol% |
Flow field orientation | 38.0 (k⊥) |
| Olefin block copolymer (OBC) | carbon fiber | 30 vol% | Melting extrusion method | 15.06 (k⊥) |
| Epoxy | Graphene-diamond framework (GRDF) | 43 wt % | Simple filtration method | 22.7 (k⊥) |
| Epoxy | CFs | 46 wt % | Stress field orientation | 32.6 (k⊥) |
| Epoxy | Graphene | 2.30 vol% | Vacuum-assisted interpenetration | 20.0 (k⊥) |