Table 1. XPS Depth Profiles—Area Percentage, Binding Energies, and FWHM Values for Ti 2p and N 1s Regions for Etching Times 21, 36, and 53 min.

etching time	peak	binding energy (eV)	fwhm	area %
21 min	T1	465.27	1.95	8.0
	T2	463.63	3.32	21.1
	T3	459.58	1.46	21.5
	T4	457.97	2.92	49.4
	N1	403.06	2.31	10.1
	N2	400.62	1.55	27.0
	N3	398.86	1.85	56.2
	N4	397.08	1.28	6.7
37 min	T1	466.22	2.54	14.2
	T2	464.10	2.84	15.5
	T3	460.89	1.65	22.0
	T4	458.99	2.83	48.3
	N1	401.89	2.28	27.0
	N2	399.87	2.03	34.9
	N3	398.39	1.14	38.1
53 min	T1	466.85	3.20	16.2
	T2	464.94	2.72	13.4
	T3	463.77	1.34	4.0
	T4	461.52	2.52	28.5
	T5	459.55	2.53	32.1
	T6	457.85	1.23	5.7
	N1	402.86	2.07	39.5
	N2	400.33	1.89	30.4
	N3	399.11	1.16	30.1