Table 1. Basic thermal-mechanical property parameters used in the simulations (Zhang et al., 2003 ▸, 2014 ▸).

Material	Si			Cu (OFHC)
Density (kg m−3)	2329			8900
Orientations	[1, 1, 1]	[1, 1, 0]	[1, 0, 0]	Isotropy
Young’s modulus (GPa)	169	130	130	115
Poisson’s ratio	0.28			0.343
Coefficient of thermal expansion (K−1)	Temperature dependent			1.77 × 10−5
Thermal conductivity (W m−1 K−1)	Temperature dependent			391