Table 2.

Comparison of adhesion measurement methods of 2D materials

Measurement method	Dominant fracture mode	Lateral resolution	Accuracy	Sample preparation effort	Measurement effort
blister test10,16	mixed mode	nm-µm	high	high	high
nanoparticles17,19	mixed mode	nm-µm	high	moderate	high
scratch testing36,38	mixed mode	µm	moderate	moderate	low
four-point bending42	mixed-mode	mm	moderate	moderate	low
nanoindentation24,25	mode I	nm	high	low	high
cantilever beam method33,34	mode I	mm	moderate	moderate	low
micro force sensing during cleavage27	mode II	µm	high	moderate	high
AFM friction measurement23	mode II	nm	low	low	high
substrate stretching on flexible substrates29–31	mode II	µm	moderate	low	moderate
button shear testing on rigid substrates this work	mode II	µm	moderate	moderate	low

The button shear test method provides viable measurements in fracture mode II with low to moderate effort on rigid substrates like silicon.