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. 2024 Mar 19;24(6):1955. doi: 10.3390/s24061955

Figure 4.

Figure 4

(a) Design with negative molds; (b) with SLA technology, a 3D-printed mold; (c) pits and electrode patterns loaded with conductive ink crafted from PDMS; (d) electrodes upon the sputtering of Au; (e) electrodes upon Au electroplating; (f) chip of Au and carbon [53].