All molecular abbreviations and their full names
HSQ (T-type H-POSS)	hydrogen silsesquioxane
POSS	polyhedral oligomeric silsesquioxane
PMMA	polymethyl methacrylate
TMAH	tetramethylammonium hydroxide
AQM-HSQ	applied quantum materials-HSQ
PAG	photosensitive acid-producing agents
HMDS	hexamethyldisilazane
APSQ	acetylated phenylsilsesquioxane oligomer
MA	methacrylic acid
Vi-POSS	octamer half-siloxane
MMA	methyl methacrylate
PMMA-POSS	polymethyl methacrylate-POSS
SH-POSS	sulfhydryl functionalization-POSS
TMPT	trihydroxymethylpropane triacrylate
PS	polystyrene
PDMS	polydimethylsiloxane
TBA	tert-butyl acrylate
CDEOPE-POSS	octa(chlorodimethylsilylethyl)-POSS
AcOSty	acetyloxystyrene
MAdMA	methacrylic acid 2-methyl-2-ammanyl ester
MaIBPOSS	methyl propylene isobutyl-POSS
AIBN	2,2′-azodiisobutyric nitrile
t-BMA	tert-butyl methacrylate
LER	line edge roughness
DSA	directed self-assembly
BCPs	block copolymers
PS-b-PMMA	polystyrene-block-polymethyl methacrylate
PMAPOSS-b-PTFEMA	poly(polyhedral oligomeric silsesquioxane methacrylate-block-2,2,2-trifluoroethyl methacrylate)
BCPs	block Copolymers
POSS-A	acrylate POSS
POSS-G	epoxy POSS
PS-b-PDMS	polystyrene-block-polydimethylsiloxane
POSS-BCPs	POSS-block copolymers
XRL	X-ray lithography
DUV-NIL	deep ultraviolet nanoimprint lithography
DSA	guided self-assembled lithography
EUV	extreme ultraviolet lithography
UV	ultraviolet
DUV	deep ultraviolet
EBL	electron Beam Lithography
NIL	nanoimprint lithography
UV-NIL	ultraviolet nanoimprint lithography
CAR	chemically amplified resist
T-NIL	thermal nano-imprint lithography
A-POSS	octa-aminopropyl POSS
C-POSS	octa-substituted carboxy-terminal POSS
SH-POSS	sulfhydryl functionalization-POSS