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. 2024 May 20;15:4258. doi: 10.1038/s41467-024-48532-6

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© The Author(s) 2024

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

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Fig. 1 — a 84CTBGA package soldered to a printed circuit board (PCB): photograph and quarter finite element model. b Micrograph and board-level finite element (FE) model of a cross-section through solder joints. c Damage accumulation in the solder near the package side after thermal cycling: experimental EBSD misorientation maps and accumulated plastic work per cycle from the board-level FE model. Displacement fields from the top and bottom of solder joints are then transferred from the board-level continuum model to the individual solder joint CPFE model. d Typical partially interlaced time-zero beachball microstructure from EBSD orientation mapping (Inverse Pole Figure IPF-X colour map) and 3D geometrical model input into the CPFE model.