Table 1.

Material composition of conventional sealer (AH Plus Root Canal Sealer) and adhesive sealers (ParaBond and ParaCore DENTIN SLOW)

AH Plus, group AH
AH Plus Paste A	Bisphenol-A epoxy resin, Bisphenol-F epoxy resin, Calcium tungstate, Zirconium oxide, Silica, Iron oxide pigments
AH Plus Paste B	Dibenzyldiamine, Aminoadamantane, Tricyclodecane-diamine, Calcium tungstate, Zirconiumoxide, Silica, Silicone oil
ParaCore, group RC
ParaCore	Methacrylates, Fluoride, Barium glass, Amorphous silica
ParaBond Non-Rinse Conditioner	Water, Acrylamidosulfonic acid, Methacrylate
ParaBond Adhesive A	Methacrylates, Maleic acid, Benzoyl peroxide
ParaBond Adhesive B	Ethanol, Water, Initiators