| PLA | Poly(Lactide) or Poly(lactic acid) |
| ROP | Ring opening polymerization |
| PLLA | Poly(L-Lactide) |
| PDLA | Poly(D-Lactide) |
| PDLLA | Poly(D, L-Lactide) |
| PEG | Poly(ethylene glycol) |
| CL | ɛ-Caprolactone |
| P[CL-co-LA] | Poly(ɛ-caprolactone-co-lactic acid) |
| VL | δ Valerolactone |
| P[Cl-co-VA] | Poly(ɛ-caprolactone-co- δ valerolactone) |
| EBS | N,N’-ethylene bis-stearamide |
| CaCO3 | Calcium Carbonate |
| BH | Benzoyl hydrazide |
| OMBH | Octamethylene dicarboxylic dibenzoyl hydrazide |
| HDT | Heat deflection temperature |
| CNT | Carbon nanotubes |
| OMMT | Organo-Montmorillonite |
| PA | Poly(amide) |
| PS | Poly(styrene) |
| PBA | Poly(butyl acrylate) |
| PBSL | Poly(butylene succinate-co-l-lactate) |
| PBT | Poly(butylene terephthalate) |
| PC | Poly(carbonate) |
| PES | Poly(ethylene succinate) |
| PET | Poly(ethylene terephthalate) |
| PVDF | Poly(vinylidene fluoride) |
| PVP | poly(vinyl pyrrolidone) |
| PVPh | poly(vinyl phenol) |
| UCST | Upper critical solution temperature |
| SAN-g-MAH | Poly(styrene-co-acrylonitrile)-g-maleic anhydride |
| EOR-MAH | Poly(ethylene-co-octene) rubber maleic anhydride |
| EGMA | Poly(ethylene-co-glycidyl methacrylate) |
| T-POSS | Tetrasilanol phenyl polyhedral oligomeric silsesquioxane |
| G-POSS | Glycidyl iso-octyl polyhedral oligomeric silsesquioxane |
| ADR | random copolymer of styrene and glycidyl methacrylate |
| TGDDM | N,N,N′,N′-tetraglycidyl-4,4′-diamino diphenyl methane |
| SMA | Styrene maleic anhydride copolymer |
| PEBA-GMA | Poly(ethylene n-butylene acrylate glycidyl methacrylate) |
| PTT | Poly(trimethylene terephthalate) |
| ESAC | Epoxy-functionalized styrene-acrylate copolymer |
| PA6 | Poly(amide-6) |
| PA (6-10) | Poly(amide-6-10) |
| PA 11 | Poly(amide-11) |
| PA (10-10) | Poly(amide-10-10) |
| PA (6-6) | Poly(amide-6-6) |
| ASAA | Alkenyl-succinide-anhydride-amide |
| ASAI | Alkenyl-succinic-anhydride-imide |
| POE-g-MAH | Poly(ethylene octene) grafted maleic anhydride |
| TPU | Thermoplastic polyurethane |
| ECE | Multifunctional epoxies |
| PCD | Polycarbodiimide |
| BN | Boron nitride |
| TsOH | p-toluene sulfonic acid |
| PLArex | modified PLA with Joncryl-ADR-4300® epoxy-based resin |
| DMBH | Decamethylene dicarboxylic dibenzoyl hydrazide |
| Tg | Glass transition temperature |
| SEM | Scanning electron microscopy |