Fig. 6.

The final configuration (on the left) and contour plot of the displacements (on the right) for the analysis conducted using ANSYS^® on a thin film (in red, with $\delta =0.3H$) laying on a soft substrate (in blue) subjected to a peeling test and characterised by a microstructure which corresponds to the discrete approximation of bond-based peridynamics. The model is full-dimensional, meaning no reduction through the thickness has been performed. Final displacement of the test amounts to $u=45\%$H. Still, comparison with results from the reduced formulation shows a very close (qualitative and quantitative) resemblance