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. 2024 Jun 26;11(8):2961–2969. doi: 10.1021/acsphotonics.3c01892

Figure 1.

Figure 1

Device layout and waveguide simulation. (a) Schematic cross-section of the graphene waveguide-integrated thermal emitter after encapsulation. The electrical connection scheme illustrates the Joule heating method to generate thermal emissions. (b) Schematic top view of the components of the PIC. (c) False-colored scanning electron micrograph before encapsulation. (d) Simulated electric field profile of the fundamental TE mode of the waveguide, including relevant materials.