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. 2024 Aug 13;24(16):5241. doi: 10.3390/s24165241

Figure 4.

Figure 4

LSM measurement of 3 hybrid PICs integrated in the PCB. (a) Optical microscopy image; (b) 3D LSM height image; (c) scale bar for the height; (d) surface profile measurement on the cross-section indicated with turquoise line in (a). The height difference between the PCB and PIC surface varies between 3 and 10 μm. Measurement errors were observed at the transition between PCB and PIC, where the transparent glue cannot be well resolved.