Table 1. Thermal and Molecular Analysis Results (N = 3 ± SD).

		glass transition (±1 °C)	melting temperature (±1 °C)	enthalpy of melting (±2 J/g)	number-average MW (kg/mol)	PD	residual monomer content (wt %)
caproprene 100M	polymer chip	–62.5	57.9	69.7	97 ± 0.6	1.5	0.11 ± 0.01
	electrospun scaffold	–62.0	57.1	55.0	102 ± 1.3	1.5	0.01 ± 0.00
Lactoflex 7415	polymer chip	23.5	172.7	50.0	172 ± 4.3	1.8	0.51 ± 0.03
	electrospun scaffold	33.4	159.5	20.5	193 ± 12.9	2.0	0.04 ± 0.00
lactoprene 100M	polymer chip	74.4	188.3	83.2	132 ± 0.6	1.4	0.06 ± 0.00
	electrospun scaffold	71.2	177.2	41.3	131 ± 5.0	1.4	0.02 ± 0.01