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. 2023 Dec 18;21(9):1684–1692. doi: 10.1038/s41592-023-02113-5

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© The Author(s) 2023

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.

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Extended Data Fig. 3 — a, d, Copper block preparation and trench milling are performed at 7° tilt angle and 180° relative stage rotation (trench milling orientation) b,e, Lift-out of the copper block is performed at 18° tilt angle and 0° relative rotation (lamella milling orientation). The same orientation is used during the attachment of Serial Lift-Out slices to the receiver grid and lamella thinning. c,f, Lift-out to obtain sections perpendicular to the grid plane is performed at trench milling orientation. Panels d-f are oblique front views of the corresponding side views shown in a-c. From this perspective, the HPF sample is located in the left shuttle position and the receiver grid is located the right shuttle position. Panels b,c,e,f show the EasyLift-needle inserted. EB and IB indicate the column of the ion beam and electron beam, respectively.