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. 2024 Aug 24;4(9):3383–3399. doi: 10.1021/jacsau.4c00583

Table 1. Current Cutting-Edge Achievements of eCO2R in the MEA System for CO, HCOOH, and C2H4.

product catalyst electrolyte FE (%) Ecell (V) EE (%) stability (h) reference
CO Ag 1 M KOH 98 3 43.45 4,380 (30)
CO Ag 0.01 M KHCO3 95 3 42.12 3,800 (54)
CO Ag 0.1 M K2SO4/1.5 M KHCO3 60 7 11.4 1,200 (31)
CO Ag 0.01 M KHCO3 98 2.95 44.18 760 (55)
CO Ag 0.5 M KHCO3 92 3.5 34.96 200 (29)
CO Ag 0.1 M CsOH 90 3 39.9 100 (28)
CO Au DI 93 2.24 55.22 100 (64)
CO Ni–N–C 0.1 M KHCO3 100 2.46 54.07 20 (57)
CO Ag 1 M KOH 99 2.23 59.04 20 (58)
CO CoPc-CN/CNT 1 M KOH 93 2 61.85 10 (59)
CO Ag 7 M KOH 86 2.8 40.85 10 (60)
CO Ag 0.01 M KHCO3 90 3 39.9 10 (61)
CO CoPC 1 M KOH 95 2.4 52.65 8 (62)
CO Zn2P2O7 1 M KOH 93.9 2.15 58.09 6.7 (63)
CO Ag 5 M KOH 73 2.75 35.31 5 (27)
HCOOH r-Pb 0.5 M K2SO4 90 2.2 54.41 5,200 (40)
HCOOH Sn DI 94 3.7 33.79 142 (65)
HCOOH Bi 0.1 M KOH 80 3 35.47 100 (66)
HCOOH Sn 1 M KOH 95 2.1 60.17 48 (70)
HCOOH SnO2 1 M KOH 61 2.3 35.27 35 (59)
HCOOH nBuLi-Bi PSE 90 1.35 88.67 30 (2)
HCOOH Sn 2 M KOH 81 2.7 40.5 25 (67)
HCOOH SnO2 0.4 M K2SO4 80 3.61 29.47 11 (68)
HCOOH Pb 0.5 M K2SO4, H2SO4 82 2.8 38.95 8.3 (69)
C2H4 Cu 0.1 M KHCO3 62 3.6 19.81 190 (71)
C2H4 Cu 7 M KOH 70 2.4 39.38 150 (72)
C2H4 Sputtering Cu 1 M KOH 65 2.85 26.23 110 (73)
C2H4 Cu 0.1 M KHCO3 38 3.75 11.65 100 (74)
C2H4 Cu(100)-rich film 0.1 M KHCO3 55.8 2.3 27.9 4.5 (12)