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. 2024 Jul 5;11(34):2402385. doi: 10.1002/advs.202402385

Figure 4.

Figure 4

a) Processing protocol for embedding wires in DCPD solid resin and subsequent photopatterned curing: i. initial layer of DCPD is poured and solidified; ii. wires are placed on top of the solidified DCPD resin; iii. Remaining DCPD resin is poured in to fill the mold and solidified; and iv. light projection of harp pattern to photopolymerize object. b) Embedded printing can generate objects with embedded solid elements, akin to the overmolding process used in injection molding. c) The solid‐state nature of the DCPD monomer allows for polymerization while also providing structural integrity, with tubing repaired by conformal recrystallization and photopolymerization of DCDP made water‐tight, allowing flow of dyed water through without leaks (see MV2). d) Once solidified, DCPD can be polymerized in a free‐form manner, generating a conformal cap to a vial. Here, solid resin was applied to the cap by repeated dipping and removing of the vial into a liquid solution of the resin. e) Volumetric printing is possible in a bulk solid sample with light sources at different angles producing different features.