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. 2024 Aug 31;15(9):1122. doi: 10.3390/mi15091122

Figure 5.

Figure 5

(a) Diagram showing the area-specific ALD process. (b) The EUV patterning process flow in combination with the area-selective deposition method: (1) EUV resist spin-coating on substrate, (2) exposure of the pattern via EUV lithography, (3) development and materials applied to (4) patterned EUV resist or (5) substrate on a selective basis [30].