Figure 5.
(a) Diagram showing the area-specific ALD process. (b) The EUV patterning process flow in combination with the area-selective deposition method: (1) EUV resist spin-coating on substrate, (2) exposure of the pattern via EUV lithography, (3) development and materials applied to (4) patterned EUV resist or (5) substrate on a selective basis [30].