Table 1.
Density [ρ] | 6.31 g cm−3 |
Molar mass | 79.55 g mol−1 |
Melting point | 1201 °C |
Stable phase at 300 K | Monoclinic |
Dielectric constant | 18.1 |
Refractive index | 1.4 |
Bandgap (E g) | 1.21–1.7 eV direct |
Cu—O bond length | 1.96 Å |
O—O bond length | 2.62 Å |
Cu—Cu bond length | 2.90 Å |
Hole effective mass | 0.24 mo |
Hole mobility | 0.1–10 cm2 V−1 s−1 |
Specific heat capacity (C p) | 540 J kg−1 K−1 |
Thermal conductivity (k) | 18 W m−1 K−1 |
Thermal diffusivity (α × 10−7) | 51.28 m2 s−1 |