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. 2024 Oct 12;15:8827. doi: 10.1038/s41467-024-53154-z

Fig. 1. Material design and molecular recognition mechanism.

Fig. 1

a Schematic illustration of fabrication processes of Cu1-TiO2-x; b schematic diagram of triple-site recognition unit of Cu1-TiO2-x for TET capture; c bonding dual-carbonyl group with Cu1 and neighboring dual-hydroxyl group with Ti sites; d SEM image of Cu1-TiO2-x, the scale bar is 2 μm; e enlarged SEM image of Cu1-TiO2-x, the scale bar is 100 nm; f DRS spectrum of Cu1-TiO2-x; g FDTD stimulation of hot-spot distribution on the nanocavity, h AC HAADF STEM image of Cu1-TiO2-x, the scale bar is 2 nm; i enlarged AC HAADF STEM image of Cu1-TiO2-x, the scale bar is 1 nm; j x–y line scan profile measured from (i); k core-level XPS spectra of Cu 2p of Cu1-TiO2-x and Cu NPs-TiO2-x; l Cu K-edge of near-edge XANES spectra for Cu1-TiO2-x and Cu foil; m R-space of Cu K-edge XAFS spectra of Cu1-TiO2-x and Cu foil; n wavelet transform of the k2-weighted EXAFS data of Cu L3-edge of Cu1 and Cu foil.