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. 2024 Oct 16;14:24294. doi: 10.1038/s41598-024-75576-x

Fig. 2.

Fig. 2

SEM micrographs of the fabrication process of the superconducting device: (a) W-C superconducting deposit by FIBID placed on the central region of the single-crystal device. (b) Fabrication of a wide junction by cutting the W-C deposit along its entire width by FIB patterning. (c) Fabrication of a hole by FIB in the center of the junction by FIB milling. (d) Final device with SQUID-like geometry.