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. Author manuscript; available in PMC: 2024 Nov 9.
Published in final edited form as: IEEE Trans Biomed Eng. 2013 Aug 8;61(1):76–84. doi: 10.1109/TBME.2013.2276770

Fig. 3.

Fig. 3

Fabrication processes for the spiral microcoil and the integrated parallel plate capacitor. (a) Cr/Cu seed layer deposition on a thin substrate. (b) negative photoresist patterned to define the lower capacitor plate and the microcoils. (c) Cu electroplating to 25 μm height, removal of the photoresist and the Cr/Cu seed layer. (d) SU-8TM patterned for the dielectric layer of the capacitor and the connection post between the coil and the capacitor, followed by Cu electroplating. (e) Cr/Cu seed layer deposition on the SU-8TM layer and negative photoresist patterning to define the upper capacitor plate and the connection traces between the coil and the capacitor. (f) Cu electroplating to 25 μm height, removal of the photoresist and the Cr/Cu seed layer.