Table 2.
Structural parameters of the CuSbS2 thin films developed by sulfurizing Cu/Sb/Cu stacks at 400 and 430 oC for different durations.
| Sulfurization temperature | Duration (min) | 2θ (degrees) | (degrees) | Crystallite size D (nm) | Strain ϵx10−3 | Dislocation density δx10−3 (nm−2) |
|---|---|---|---|---|---|---|
| 400 oC | 10 | 28.39 | 0.382 | 22.4 | 0.48 | 1.99 |
| 30 | 28.39 | 0.382 | 22.4 | 0.48 | 1.99 | |
| 60 | 28.40 | 0.331 | 25.9 | 0.19 | 1.49 | |
| 90 | 28.41 | 0.331 | 25.9 | 0.19 | 1.49 | |
| 430 oC | 10 | 28.39 | 0.382 | 22.4 | 0.48 | 1.99 |
| 30 | 28.41 | 0.331 | 25.9 | 0.19 | 1.49 | |
| 60 | 28.41 | 0.331 | 25.9 | 0.19 | 1.49 | |
| 90 | 28.43 | 0.331 | 25.9 | 0.19 | 1.49 | |