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[Preprint]. 2024 Dec 5:rs.3.rs-5463005. [Version 1] doi: 10.21203/rs.3.rs-5463005/v1

Fig.2|. ME backscatter external transceiver design.

Fig.2|

a) Overview of the ME communication system components. The proposed system combines a custom external transceiver (Supplementary Fig1) and an mm-sized magnetoelectric implant. The power and downlink data are wirelessly delivered through the ME link; the ME backscatter is exploited for uplink communication. b) Transmitter ringdown suppression solution. The transmitter resonance circuit is powered by an H-bridge. To avoid cross-coupling between the transmitter excitation field and the backscattered field during the ringdown period, the transmitter ringdown is suppressed by adding an AC MOSFET in series to switch a 330-ohm damping resistor. c) ME backscattered field receiver circuit. The pickup coil is isolated from the detection circuit through a high-voltage AC switch during the excitation field. Once the field is off, the pickup coil is connected to the front-end detection circuit that combines a low pass filter(LPF), low noise amplifier (LNA), and variable gain amplifier (VGA) to amplify and filter the measured signal.