Table 1.
Choice of TCOs considering various properties [33].
| Property | Material |
|---|---|
| Lowest price | SnO2:F |
| Least harmful | SnO2:F; ZnO:F |
| Optimal resistance to H plasmas | ZnO:F |
| Maximum frequency of plasma | In2O3:Sn; TiN; Ag |
| Minimum frequency of plasma | ZnO:F; SnO2:F |
| Maximum conductivity | In2O3:Sn |
| Maximum transparency | Cd2SnO4; ZnO:F |
| Maximum work function; best contact to p-Si | ZnSnO3; SnO2:F |
| Minimum work function; best contact to n-Si | ZnO:F |
| Optimal thermal stability | Cd2SnO4; SnO2:F; TiN |
| Optimal chemical durability | SnO2:F |
| Optimal mechanical durability | SnO2:F; TiN |
| Minimum deposition temperature | ZnO:B; In2O3:Sn; Ag |
| Easily etched | TiN; ZnO:F |