| HDPE | High-density polyethylene |
| PA | Polyamide |
| POM | Polyoxymethylene |
| DTBP | Di-tert-butyl peroxide |
| TAIC | Triallyl isocyanurate |
| BIPB | Bis (tertbutyldioxyisopropyl) benzenehexane |
| BCUP | Di-tert butyl cumyl peroxide |
| DLTDP | Didodecyl thiodipropionate |
| A1076 | Antioxidant 1076 |
| CaSt | Calcium stearate |
| PEXa | Peroxide cross-linking |
| PEXb | Silane cross-linking |
| PEXc | Radiation cross-linking |
| Xc | Crystallinity |
| Tm | Melting temperature |
| Tc | Crystallization temperature |
| Theoretical melting temperature of the HDPE | |
| G | Cross-linking degree |
| aiN | Impact strength |
| Ee | Impact test fracture absorption energy |
| bN | Specimen’s remaining width |
| ΔHm | Enthalpy of melting obtained from the DSC melting curve |
| ΔHm,100% | Theoretical enthalpy of melting of the HDPE with a crystallinity of 100% |
| ΔHc | Enthalpy of crystallization |
| LDSC | Average thickness of wafers |
| δ | The free energy of HDPE wafer surface |
| DSC | Differential scanning calorimeter |
| HDT | Heat deformation temperature |
| VST | Vicat softening temperature |
| SEM | Scanning electron microscopy |
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