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. 2025 Feb 21;18(5):948. doi: 10.3390/ma18050948
ALD Atomic layer deposition
DP Direct plasma
CTL Charge-trapping layer
CTM Charge-trapping memory
MHOTM Sin++/HfO2/Al2O3/TiO2/Al
PE Plasma-enhanced
P/E Program/erase
RP Remote plasma