1. Summary of RRAM Integrated Demonstrators ,− .
| Year | Node [nm] | Capacity | Institution | Stack | Ref |
|---|---|---|---|---|---|
| 2011 | 180 | 4 Mb | ITRI | TiN/Ti/HfO2/TiN | |
| 2011 | 130 | 384 kb | Adesto | Ag/GeS2 | |
| 2011 | 180 | 4 Mb | Sony | CuTe/GdO x | |
| 2012 | 180 | 8 Mb | Panasonic | TaN/TaO2/Ta2O5/Ir | |
| 2013 | 180 | 500 kb | Panasonic | TaN/TaO2/Ta2O5/Ir | |
| 2013 | 24 | 32 Gb | Sandisk/Toshiba | Metal Oxide | |
| 2014 | 28 | 1 Mb | TSMC | Metal Oxide | |
| 2014 | 27 | 16 Gb | Micron/Sony | Cu-based/oxide | |
| 2015 | 90 | 2 Mb | Renesas | Metal/Ta2O5/Ru | |
| 2017 | 90 | 500 kb | Winbond | TiN/HfO2/Ti/TiN | |
| 2018 | 40 | 11.3 Mb | TSMC | ||
| 2019 | 22 | 3.6 Mb | Intel | ||
| 2020 | 22 | 13.5 Mb | TSMC | ||
| 2020 | 28 | 500 kb | TSMC | ||
| 2020 | 28 | 1.5 Mb | TSMC/IMECAS | ||
| 2021 | 14 | 1 Mb | IMECAS | Cu-based/oxide | |
| 2022 | 28 | 800 kb | Infineon/TSMC | ||
| 2023 | 12 | 1 Mb | TSMC |